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NUP4103FC
Four Channel ESD Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive portable equipment and other
applications. Its integrated design provides very effective and reliable
protection for four (4) separate lines using only one package. These
devices are ideal for situations where board space is a premium.
http://onsemi.com
Features
? Unidirectional, Quad ESD Protection
? Ultra ? small Flip ? Chip Packaging (0.95 mm x 1.33 mm)
? Compliance with IEC61000 ? 4 ? 2 (Level 4) Requirements
? Maximum Leakage Current of 100 nA at 3.3 V
? Pb ? Free Package is Available*
A1
CIRCUIT DESCRIPTION
B2
C1
Benefits
? Protects Four Data Lines from ESD while Reducing Component
Count
? Small Package Saves on PCB Real Estate
? Provides Protection for ESD Industry Standards, IEC 61000,
HBM and MM
? Low Leakage Capability Minimizes Power Loss in the System
Applications
? ESD Protection for Portable Equipment
? Cell Phones
? MP3 Players
? PDAs
A3 C3
MARKING
1 DIAGRAM
5 ? PIN FLIP ? CHIP CSP EM G
PLASTIC G
CASE 766AB
E = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
MAXIMUM RATINGS
TOP VIEW
(Bumps Down)
BOTTOM VIEW
(Bumps Up)
Rating
ESD Discharge IEC61000 ? 4 ? 2,
? Air Discharge
? Contact Discharge
Human Body Model
Machine Model
Junction Temperature
Symbol
V PP
T J
Value
30
30
16
1.6
150
Unit
kV
° C
A
B
C
1 2 3
A
B
C
3
2 1
Operating Ambient Temperature Range
T A
? 40 to +85
° C
Storage Temperature Range
T STG
? 55 to +150
° C
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device
NUP4103FCT1
NUP4103FCT1G
Package
Flip ? Chip
Flip ? Chip
Shipping ?
3000/Tape & Reel
3000/Tape & Reel
(Pb ? Free)
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2006
March, 2006 ? Rev. 1
1
Publication Order Number:
NUP4103FC/D
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